Professor Ma Shenglin
Ph.D. Supervisor
Deputy Director of the Department of Mechanical and Electrical Engineering
Email: mashenglin@xmu.edu.cn
Address: Room 273, Aerospace Building, Xiang'an Campus, Xiamen University
Education
[1] 2008.09-2012.07, College of Information Science and Technology, Peking University, Major in Microelectronics and Solid State Electronics, Ph.D., awarded the title of "Peking University Outstanding Graduate" and "Beijing Outstanding Graduate".
[2] 2005.09-2008.07, College of Information Science and Technology, Peking University, Major in Electronics and Communication Engineering, Master's Degree;
[3] 2001.09-2005.07, Henan University, Major in Physics, Bachelor's Degree;
Research Interests
Three-dimensional integration manufacturing technology of integrated circuit chips with Through-Silicon Via (TSV), manufacturability modeling and simulation technology, reliability modeling and simulation technology, digital twin technology, big data mining and application in integrated circuit manufacturing processes, embedded microfluidic cooling technology, application research of TSV three-dimensional integration in RF, optoelectronics, implantable microsystems, etc., PMUT and new applications, microfluidic chips, micro-nano robots, etc.
Teaching Positions
"Electronic Technology"
"Micro-Electro-Mechanical Systems (MEMS) Devices and Applications"
"Microelectronics/Integrated Circuit Process Experiment"
"Introduction to Intelligent Manufacturing"
"Modern Engineering Design and Analysis Software", etc.
Research Projects
In recent years, as the principal investigator or project leader, he has undertaken more than 10 national key projects, including basic strengthening projects, national key R&D plans, pre-research key projects, and National Natural Science Foundation projects, as well as more than 30 commissioned projects from enterprises and institutions. Representative projects he has led in the past five years include:
[1] National Natural Science Foundation Major Research Plan Project, Research on Silicon Microchannel Integration Manufacturing, Thermal Design, and Failure Mode of 10,000-Watt Level 2.5D/3D Integrated Wafer-Level Chip Packaging, Principal Investigator, 2024.01-2026.12;
[2] Innovation Zone Project, *******, Principal Investigator, 2023.07-2024.10;
[3] Xiamen Science and Technology Plan Major Project, Research and Industrialization of High-Power Silicon Carbide Based Gallium Nitride RF Chips for 5G Base Stations, Subject Leader, 2023.07-2025.12;
[4] National Key R&D Plan Project, Wafer-Level Three-Dimensional Integration Technology Based on Sub-Micron TSV, Sub-Task Leader, 2023.12-2027.11;
[5] Equipment Pre-Research Project, 3D Imaging Sonar Technology of PMUT Array, XMU Project Leader, 2023.06-2026.05;
[6] Basic Strengthening Project, *******, Subject Leader, 2022.08-2024.08;
[7] National Key R&D Plan Project, Medical Micro-Nano Integrated Chips and Integrated Systems, Sub-Task Leader, 2020.01-2023.12;
[8] Pre-Research Key Project, Integrated *** Technology, XMU Project Leader, 2020.01-2020.12;
[9] Pre-Research Key Project, GaN Micro*** Thermal Management Technology, XMU Project Leader, 2019.12-2020.12;
[10] Pre-Research Key Project, TSV*** Technology, Principal Investigator, 2017.07-2020.07;
[11] Xiamen Municipal Bureau of Industry and Information Technology Project, Course Design and Development for Digital Talents in Xiamen Manufacturing Industry (Phase II), Principal Investigator, 2021.09-2021.11;
Invention Patents
In recent years, more than 100 patents have been applied for, including over 40 authorized patents:
[1] XMU Chip Integration Packaging Microsystem Thermal-Mechanical Coupling Cloud Simulation Platform, Copyright, 2023SR0481059;
[2] XMU Chip Micro-Interconnection Structure Reliability Simulation Software V1.0, Copyright, 2023SR0481046;
[3] A Micro-Nano Structure Mechanical Characteristic Parameter Measuring Device, Measuring Plate, and Measuring Method, by Mashenglin Ma and Xiaodong Wu, Invention Patent, ZL202010909629.3;
[4] A Method and Structure for the Integrated Packaging of MEMS Devices and ASIC Processing Circuit ICs, by Mashenglin Ma, Invention Patent, ZL201910124346.5;
A Packaging Structure for Miniaturized Integrated Cooling of RF Front-End Based on Composite Phase Change Materials, by Mashenglin Ma and Dan Gong, Invention Patent, ZL201811202164.7;
[5] A Three-Dimensional Heterogeneous Structure Packaging Method for Layer Cooling of High-Power GaN Devices, by Mashenglin Ma and Han Cai, Invention Patent, ZL201810601226.5;
[6] A High-Density SOI Packaging Substrate and Its Manufacturing Method, by Mashenglin Ma, Invention Patent, ZL201611015068.2;
[7] A Semiconductor Structure with Vertical Through-Hole Interconnection and Its Manufacturing Method, by Mashenglin Ma, Invention Patent ZL201611015068.2;
Selected Publications
In recent years, more than 70 academic papers indexed by SCI/EI have been published as the first or corresponding author in top journals such as Microsystems & Nanoengineering, SNB, and at top conferences including IEEE MEMS, microTAS, ECTC, Itherm, etc. Representative papers in the past five years are as follows:
【1】 Mashenglin Ma, Luming Chen, Tongquan Zhang, Yan Wang, Yixu Wang, Qiqiang Wang, Xiong Xiao, Wei Wang, Research on the Control Mode of Copper Filling for TGV Through-Hole Plating and Process Reliability Test, Science China: Chemistry, ISSN 1674-7224, [DOI: 10.1360/SSC-2023-0141] (https://doi.org/10.1360/SSC-2023-0141).
【2】 Mashenglin Ma, Yan Wang, Luming Chen, Fangzu Yang, Yan Wang, Qiqiang Wang, Xiong Xiao, Recent Progress in Research on Additives and Mechanism of TSV Copper Electroplating, Science China: Chemistry, ISSN 1674-7224, [DOI: 10.1360/SSC-2023-0167] (https://doi.org/10.1360/SSC-2023-0167).
【3】Xiaodong Wu , Zhizhen Wang , Shenglin Ma * , Xianglong Chu,Chunlei Li , Wei Wang , Yufeng Jin and Daowei Wu .A RDL Modeling and Thermo_x005f
Mechanical Simulation Method of 2.5D/3D Advanced Package Considering the Layout Impact Based on Machine Learning.Micromachines 2023, 14, 1531.
【4】Xiaodong Wu , Shenglin Ma *, Zhizhen Wang , Wei Wang, Yufeng Jin .An inter-scale simulation method for TSV 3D IC based on linear superposition
algorithm and TSV model sharing strategy.Microelectronics Reliability, 144,2023,114957.
【5】Tingting Lian, Yanming Xia, Zhizheng Wang, Xiaofeng Yang, Zhiwei Fu, Xin Kong, Shuxun Lin, Shenglin Ma*, Thermal property evaluation of a 2.5D integration method with device level microfluidic direct cooling for high power GaN HEMT device, Microsystems and Nanoengineering,(2022) 8:119. (SCI 一区《Nature》旗下唯一工程类期刊、仪器仪表领域顶刊)；
【6】Yanming Xia, Chao Song, Yingchao Meng, Peng Xue, Andrew J. deMello, Quan Gao, Stavros Stavrakis, Shenglin Ma*, Xiaobao Cao*, An addressable electrowetting valve for centrifugal microfluidics, Sensors and Actuators B: Chemical, 2022, 369, 132276. (SCI 一区,Elsevier旗下仪器仪表领域顶刊)；
【7】Yanming Xia , Xianglong Chu , Caiming Zhao , Nanxin Wang , Juan Yu , Yufeng Jin , Lijun Sun ，Shenglin Ma *, A glass-ultra-thin PDMS film-glass microfluidic device for digital PCR application based on flexible mold peel-off process, Micromachines, 2022, 13(10):1667. （SCI 二区）；
【8】Yanming Xia, Zetian Wang, Lu Song, Wei Wang, Jing Chen*, Shenglin Ma*, Inductively coupled plasma etching of bulk tungsten for MEMS applications, Sensors and Actuators A: Physical, 2022, 345, 113825.(SCI 二区)；
【9】Chen Wang, Yang Yang, Lifeng Qin*, Shenglin Ma* ， Yufeng Jin*. "A Strategy for Extracting Full Material Coefficients of AlN Thin Film Based on Resonance Method" Micromachines 2022,13, no.4: 513.(SCI 二区)；
【10】Mengcheng Wang, Shenglin Ma*, Yufeng Jin, et al. "A RF Redundant TSV Interconnection for High Resistance Si Interposer" Micromachines 2021,12, no. 2: 169.(SCI 二区)；
【11】Yihsiang Chiu , Chen Wang , Dan Gong , Nan Li, Shenglin Ma*, Yufeng Jin*. 2021. "A Novel Ultrasonic TOF Ranging System Using AlN Based PMUTs" Micromachines 12, no. 3: 284.(SCI 二区)；
【12】Han Cai, Jun Yan, Shenglin Ma*, Rongfeng Luo, et al. Design, fabrication, and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration[J]. Journal of Micromechanics and Microengineering, 2019, 29(7):075002-.(SCI 三区)；；
【13】Rongfeng Luo, Shitao Wang, Yanming Xia, Shenglin Ma*, Wei Wang, Jing Chen, Yufeng Jin. Fabrication and Characterization of a Low Parasitic Capacitance and Low-Stress Si Interposer for 2.5-D Integration[J]. IEEE Transactions on Semiconductor Manufacturing, 2018, 31(4):521-527.（SCI 二区）；
【14】Jun Yan , Shenglin Ma*, Yufeng Jin, Wei Wang , Jing Chen, Rongfeng Luo, Han Cai, Jiwei Li,Yanming Xia, Lilin Hu, Shuwei He, Zhongjun Tang. Fabrication and RF Property Evaluation of High-Resistivity Si Interposer for 2.5-D/3-D Heterogeneous Integration of RF Devices[J]. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2018, PP:1-9.
Academic Monographs
[1] Three-Dimensional RF Integrated High-Resistance Silicon TSV Interposer Technology, by Mashenglin Ma and Yufeng Jin, Chemical Industry Press, Beijing (supported by the National Science and Technology Academic Monograph Publishing Fund in 2023);
[2] TSV 3D RF Integration: HR-Si Interposer Technology, by Shenglin Ma and Yufeng Jin, Elsevier, April 2022. (Paperback ISBN: 9780323996020, eBook ISBN: 9780323996037);
[3] TSV Three-Dimensional RF Integration: High-Resistance Silicon Interposer Technology, by Mashenglin Ma and Yufeng Jin, Chemical Industry Press, Beijing, June 2021. (ISBN: 9787122394842, selected as a key national publication project in the 13th Five-Year Plan);
[4] TSV Three-Dimensional Integration: Theory, Technology, and Applications, by Yufeng Jin and Mashenglin Ma, Science Press, Beijing, September 2022. (ISBN: 9787030618368, supported by the National Science and Technology Academic Monograph Publishing Fund Project);
