Professor Wang Lingyun, Ph.D. Supervisor;
Xiamen Double Hundred Talents,
Key Talent of Xiamen,
Vice Director of Xiamen Micro-Electro-Mechanical Systems Research Association
Email: wangly@xmu.edu.cn
Address: Room 223, Aerospace Building, Xiang'an Campus, Xiamen University
Education
[1]Sep 2004 - Dec 2009, Xiamen University, Department of Mechanical and Electrical Engineering, Direct Ph.D. Program, Doctorate in Measurement Technology and Instrumentation
[2]Sep 1997 - Jul 2001, Xiamen University, Department of Mechanical and Electrical Engineering, Bachelor of Engineering in Measurement and Control Technology and Instruments
Research Interests
1) Design and key process development of MEMS devices;
2) Integration, packaging, and functional testing of MEMS devices;
3) Development, design, and functional application of sensors for modern or extreme environments;
4) Development of micro-nano manufacturing technology and equipment based on air flotation, electrostatic, and piezoelectric jetting;
5) Design and process development of high-temperature thin-film sensors.
Teaching Positions
1. Electronic Technology (Undergraduate)
2. Fundamentals of Mechanical Engineering Testing Technology (Undergraduate)
3. Principles and Applications of Sensors (Undergraduate)
4. Design and Process of Micro-Nano Electromechanical Systems (Graduate)
5. Fundamentals of Integrated Circuit Design (Undergraduate)
6. Industry 4.0 and Intelligent Manufacturing (General Education Course for Undergraduates)
Research Projects
1. Enterprise-commissioned project: Development of X/Y MEMS gyroscope, Aug 2021-Dec 2022, Ongoing.
2. Enterprise-commissioned project: Development and process wafer of MEMS piezoresistive pressure sensor sensitive chips, Oct 2021-Jun 2022, Ongoing.
3. Enterprise-commissioned project: Design and development of MEMS high-precision resonant pressure sensor sensitive chips, Nov 2021-Jun 2022, Ongoing.
4. National Natural Science Foundation of China, 61674125, Research on the structure-performance relationship and energy-controlled adsorption behavior of porous nano-supports as getters for MEMS packaging, Jan 2017-Dec 2020, Completed, Principal Investigator.
5. Major project of Fujian Province Science and Technology Plan, 2015H6022, Industrialization research and development of high-speed and high-viscosity precision jetting dispensing system, Apr 2015-Apr 2018, Completed, Principal Investigator.
6. Fujian Province Health and Education Joint Research Project "3D printing blood vessel modeling and fluid dynamics research for the diagnosis and treatment of aortic dissection", Completed, Principal Investigator.
7. National Youth Science Foundation Project "Mutation mechanism and behavior law of physical properties of near-field electrospun nanofibers" (Project No.: 51105320), Project Leader, Completed.
8. Xiamen University "Central University Basic Scientific Research Business Fee Special Fund" Project "Development of precision jetting dispensing head" (Project No.: 2010121039), Project Leader, Completed.
9. Enterprise cooperation project: Engineering and technical development of silicon resonant pressure core, Jul 2019-May 2021, Completed.
10. Enterprise cooperation project: Design simulation and three-layer bonding of silicon MEMS resonant pressure sensors, Feb 2019-Nov 2019, Completed.
11. Enterprise cooperation project: Development of piezoelectric valves for on-demand eutectic alloy jet, Nov 2019-Dec 2019, Completed.
12. Enterprise cooperation project: Development of BMS host computer software system, Aug 2018-Feb 2019, Completed.
13. Enterprise cooperation project: Design/process R&D of silicon piezoresistive pressure sensors, Dec 2017-Dec 2018, Completed.
14. Enterprise cooperation project: Design and key process of high-temperature shear stress sensors, Dec 2017-Jun 2018, Completed.
15. Enterprise cooperation project: Research on typical micro-processes based on SiC, Dec 2017-Nov 2018, Completed.
Invention Patents
(1) Wang Lingyun, Cai Jianfa, Li Yipang, He Yong, Du Xiaohui, Wang Xiaoping. A jetting dispensing head, May 27, 2015, China, ZL201310073952.1
(2) Wang Lingyun, Chen Mengyue, Liang Chuwei, Cai Jianfa, Zhou Ruhai, Du Xiaohui. A self-heating automatic alignment and uniform glue machine, May 13, 2015, ZL201310263210.5
(3) Wang Lingyun, Wang Shen, Zhang Haoer, Du Xiaohui, Cai Jianfa, Zhan Zhan, Sun Daoheng. A redistribution method for heavily doped boron silicon wafers, April 1, 2015, China, ZL201310074216.8
(4) Wang Lingyun, Lv Wenlong, Du Xiaohui, Su Yuanzhe, Zhan Zhan, Zuo Wenjia, Sun Daoheng. A vacuum packaging method for micro devices, February 18, 2015, China, ZL201210025120.8
(5) Wang Lingyun, Du Xiaohui, Qiu Xiaochun, He Jie, He Guangqi, Li Yipang, Sun Daoheng. A silicon micro-resonant pressure sensor and its manufacturing method, August 27, 2014, China, ZL201210282401.1
(6) Wang Lingyun, Su Yuanzhe, Du Xiaohui, Zhan Zhan, Sun Daoheng. A pressure sensor based on nano piezoelectric fibers, July 24, 2013, China, ZL201110343031.3
(7) Wang Lingyun, Sun Daoheng, Du Jiang, Wu Dezhi, Lv Wenlong, Liu Yifang. A controllable electrospinning direct writing nozzle with start-stop function. Invention Patent, Patent No.: ZL201010611543.9.
(8) Wang Lingyun, Jiang Yiwen, Du Jiang, Lv Wenlong, Zhang Chi, Zou Jiannan, Sun Daoheng. A fully symmetric silicon micro-resonant pressure sensor. Invention Patent, Patent No.: Zl201010611298.1.
(9) Wang Lingyun, Xi Kailong, Yang Zhengxiong, Zuo Wenjia, Sun Daoheng. A wafer bonder for grinding and polishing. Utility Model. Patent No.: ZL201220224588.5.
(10) Wang Lingyun, Du Xiaohui, Zhan Zhan, Zuo Wenjia, Su Yuanzhe, Lv Wenlong, Sun Daoheng. A soldering iron holder based on intelligent temperature control and power cut-off protection. Utility Model. Patent No.: ZL201220031307.4.
Selected Publications
[1]Bu, Zhenxiang; Liu, Lujiang; Zhong, Changzhi; Wang, Shiqi; Gu, Dandan; Wang, Lingyun*. An Innovative LC-C Resonant Pressure Sensor Based on Capacitive Feedthroughs. IEEE Sensors Journal, 1530-437X, 2021-09-15.
[2]Yuchao Zhu; Lingke Yu; Dezhi Wu; Wenlong Lv; Lingyun Wang. A high-sensitivity graphene ammonia sensor via aerosol jet printing. Sensors and Actuators A Physical, 318 (2021) 112434.
[3]Lingyun Wang，Daner Chen，Heng Xiong，Yifang Liu. "Design and Optimization of Glass Frit Package Structure for Micro Pressure Switch." 2021 IEEE 16th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) IEEE, 2021.
[4]Yifang Liu，Hongbo Sang，Zhenxiang Bu，Yulong Zhang，Lingyun Wang*. "Influence of the Particle Size of Glass Powder on Sintering Characteristics in TGV Packaging." 2021 IEEE 16th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) IEEE, 2021.
[5]Huang, Xiang; Jin, Hang; Lin, Siying; Bu, Zhenxiang; Lin, Zhihong; Tu, Wenchang; Wang, Lingyun*; Adaptive electrofluid-actuated liquid lens, Optics Letters, 2020, 45(2)：331-334.
[6]Xiang Huang, Siying Lin, Zhenxiang Bu, Wang, Lingyun*. Research on nozzle and needle combination for high frequency piezostack-driven dispenser. International Journal of Adhesive and Adhesives , 2020:102453.
[7]Wang, Lingyun*; Huang, Xiang; Lin, Siying; Bu, Zhenxiang; Jin, Hang; Lin, Xiaolong; Lin, Zhihong; Xie, Peiqin; Design and experiment of a jetting dispenser with compact amplifying mechanism and low stress in piezostack, Journal of Intelligent Material Systems and Structures, 2020, 31(5):788-798.
[8]Siying, Lin; Xiang, Huang; Dandan, Gu; Wenlong, Lv; Lingyun, Wang*; Investigation on Nickel-Based Nano-Scaffold Getter With Induction Heating and Rapid Activation, IEEE Transactions on Nanotechnology, 2020, 19：67-70.
[9]Huang, Xiang; Lin, Xiaolong; Jin, Hang; Lin, Siying; Wang, Lingyun*; Effect of Enhanced Squeezing Needle Structure on the Jetting Performance of a Piezostack-Driven Dispenser, Micromachines, 2019, 10(12)：0-850.
[10]Bu, Z., Lin, S., Huang, X., Li, A., Wu, D., Zhao, Y., Luo Z., & Wang, L.*.. A novel piezostack-driven jetting dispenser with corner-filleted flexure hinge and high-frequency performance. Journal of Micromechanics & Microengineering, 2018，28(7)，075001.
[11]Wang, L., Du, X., Wang, L.*, Xu, Z., Zhang, C., & Gu, D. (2017). High-Q Wafer Level Package Based on Modified Tri-Layer Anodic Bonding and High Performance Getter and Its Evaluation for Micro Resonant Pressure Sensor. Sensors, 17(3), 599.
[12]Zhan, Z., Li, W., Yu, L., Wang, L.*, & Sun, D. (2017). Study of Thermal Electrical Modified Etching for Glass and Its Application in Structure Etching. Materials, 10(2), 158.
[13]Du, X., Wang, L., Li, A., Wang, L.*, & Sun, D*. (2017). High Accuracy Resonant Pressure Sensor With Balanced-Mass DETF Resonator and Twinborn Diaphragms. Journal of Microelectromechanical Systems, 26(1), 235-245.
[14]Li, A., Zhang, C., Wang, H., He, Y., Sun, D., Wang, L.*, ... & Gu, D*. (2017). Design of temperature-immunization system packaging for the resonant pressure sensor. Modern Physics Letters B, 31(08), 1750085.
[15]Mahmoodi, S., Guoqing, H., Wang, L., & Nourikhajavi, M. (2017). Two-dimensional spin coating technology and the effect of artificial gravity on film’s air-bubbling. Microsystem Technologies, 23(5), 1585-1594.
[16]Wu, D., Xiao, Z., Deng, L., Sun, Y., Tan, Q., Dong, L., Wang, L*, & Zhao, Y. (2016). Enhanced Deposition Uniformity via an Auxiliary Electrode in Massive Electrospinning. Nanomaterials, 6(7), 135.
[17]Yifang, L., Daner, C., Liwei, L., Gaofeng, Z., Jianyi, Z., Lingyun, W*., & Daoheng, S.* (2016). Glass frit bonding with controlled width and height using a two-step wet silicon etching procedure. Journal of Micromechanics and Microengineering, 26(3), 035018.
[18]Luo, Z., Zheng, G., & Wang, L.* (2016). A Study on the Influence of the Nozzle Lead Angle on the Performance of Liquid Metal Electromagnetic Micro-Jetting. Micromachines, 7(12), 220.
[19]Zheng, C., Li, W., Li, A. L., Zhan, Z., Wang, L. Y*., & Sun, D. H. (2016). Design and Manufacturing of a Passive Pressure Sensor Based on LC Resonance. Micromachines, 7(5), 87.
[20]Du, X., Liu, Y., Li, A., Zhou, Z., Sun, D., & Wang, L*. (2016). Laterally Driven Resonant Pressure Sensor with Etched Silicon Dual Diaphragms and Combined Beams. Sensors, 16(2), 158
